Shaping the Future –
What’s Next for
RRP Electronics?
At RRP Electronics, we’re always looking ahead. From cutting-edge technology rollouts to new strategic partnerships, here’s a glimpse into what’s coming next.
Next-Gen Projects in the Making
Compound Semiconductor FAB
- Initiated: November 2024
- Expected: 2026
A next-gen facility focused on high-performance compound semiconductors for future-ready applications.
Wafer Level Packaging (with DECA Technologies)
- Initiated: November 2024
- Expected: 2026
An advanced packaging solution designed to redefine performance, efficiency, and scalability in semiconductor devices.