Maharashtra’s First
Operational OSAT Facility.
Expanding Forward.

Driving India’s semiconductor momentum with scalable, next-gen packaging and testing capabilities from the heart of Maharashtra.

Packaging Services

QFN Packages

Quad Flat No-Lead (QFN) is a surface-mount IC package with no external leads, offering excellent thermal and electrical performance in a compact form.

Compact & lightweight
Suited for space-constrained designs.
Thermal Performance
Enables smooth operations.
Applications
IoT, mobile, RF, consumer, automotive & industrial systems

Industries We Power

01
Telecommunication
Ultra-fast, low-latency network processing.
02
Industrial
Smart grids, renewable energy integration, efficient power distribution.
03
Automotive & EVs
Smart chips for self-driving cars & battery management.
04
Medical & Healthcare
Next-gen diagnostic & wearable tech.
05
Commercial
Advanced IoT solutions, smart retail systems, intelligent automation.
06
Advanced Computing
Future-ready computing for complex applications.